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Power Supply |
220V 50HZ |
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Electric Current |
6.3A |
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Plate diameter |
300mm, 350mm, 420mm |
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Plate speed |
0-120rpm (range can be adjusted) |
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Jig rotation speed |
0-120rpm (range can be adjusted) |
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Work Time |
0-10 hours |
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Acceptable Wafer Size |
3 inches, 4 inches, 6 inches |
A Precision Polishing Machine is an industrial device used to achieve smooth, mirror-like surfaces on materials by removing minute surface irregularities.
High-precision polishing effect
The Precision Polishing Machine use advanced polishing technology and high-precision control systems to ensure that the surface roughness of polished parts is significantly reduced, and even a mirror effect can be achieved. Secondly, the high-precision sensors of our machines are combined with intelligent algorithms to accurately identify the contours of the workpiece, and even tiny gaps can be perfectly processed to achieve micron-level polishing effects.
High-efficiency automated production
The equipment is equipped with an advanced automated control system, which can realize automated operation and greatly improve production efficiency. Compared with traditional manual operation or old machinery, our machines can complete high-precision polishing operations in a very short time, with an efficiency increase of up to 300%.
Diverse polishing process options
Our machines support a variety of polishing process options, including rough polishing, medium polishing, fine polishing, etc., to meet the polishing needs of parts of different materials and shapes. In addition, the equipment is also equipped with polishing discs and accessories of various specifications, which can be flexibly configured and replaced according to actual needs to achieve more accurate and efficient polishing effects.
Easy to maintain
Our machines are designed with full consideration of the needs of easy maintenance and upkeep. The structure of the equipment is compact and reasonable, and it is easy to disassemble and clean. At the same time, the equipment is equipped with a complete fault diagnosis and alarm system, which can be discovered and handled in time in case of abnormal conditions.
HISEMI Technology (Beijing) Ltd. is committed to promoting the development of compound semiconductor grinding and polishing equipment, focusing on developing cutting-edge processes and constantly breaking through the industry's technological boundaries.
The state-of-the-art production facility is meticulously designed to meet modern, intelligent manufacturing standards. It features a scientifically optimized layout with clearly defined production areas. The integration of advanced equipment and proprietary intelligent control systems showcases the company's technological strength. For instance, HISEMI's high-precision grinding machines achieve exceptional flatness control, maintaining grinding disc flatness errors within less than 2 nanometers. This precision lays a solid foundation for producing top-tier equipment.
HISEMI Technology (Beijing) Ltd. remains committed to becoming a global leader in semiconductor grinding and polishing equipment, driving the evolution of precision processing for semiconductor materials.
Q: What Industries Use Precision Polishing Machines?
A: Precision Polishing Machines are essential in industries such as semiconductor manufacturing, optics, electronics, aerospace, automotive, and medical device production. They are used to achieve high surface quality and meet strict dimensional tolerances.
Q: How Does a Precision Polishing Machine Work?
A: The machine uses a rotating polishing pad, along with a polishing slurry or compound, to gradually remove surface material. Pressure, speed, and polishing time are precisely controlled to achieve the desired surface finish.
Q: What Materials Can Be Polished Using a Precision Polishing Machine?
A: It can polish a wide range of materials, including metals (e.g., stainless steel, aluminum), ceramics, glass, semiconductors (e.g., silicon wafers), optical lenses, and composite materials.
Q: What Are the Benefits of Using a Precision Polishing Machine?
A: Benefits include consistent surface quality, improved optical clarity, reduced surface roughness, enhanced durability, and minimized material wastage. It also enables precise control over polishing parameters for customized results.
Q: How Is Surface Quality Measured After Polishing?
A: Surface quality is typically measured using surface roughness parameters (e.g., Ra, Rz) and optical inspection methods. In semiconductor and optical applications, interferometers and profilometers are used to assess flatness and smoothness.
Q: What Is the Difference Between Grinding and Polishing?
A: Grinding removes larger amounts of material quickly to shape or prepare surfaces, while polishing involves finer abrasives and controlled processes to create a smooth, reflective finish. Polishing is often the final step after grinding.
Q: How Can a Precision Polishing Machine Improve Production Efficiency?
A: Automated precision polishing machines reduce manual labor, improve consistency, and shorten processing times. They ensure repeatable results, minimize defects, and enhance overall productivity, especially in high-volume manufacturing.
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