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Power Supply |
220V 50HZ |
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Electric Current |
6.3A |
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Plate diameter |
300mm, 350mm, 420mm |
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Plate speed |
0-120rpm (range can be adjusted) |
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Jig rotation speed |
0-120rpm (range can be adjusted) |
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Work Time |
0-10 hours |
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Acceptable Wafer Size |
3 inches, 4 inches, 6 inches |
High precision lapping system: adopting advanced lapping disc design, its material has been specially treated to have extremely high wear resistance and flatness, ensuring uniform force application during the lapping process and achieving precision control of the workpiece surface at the micrometer or even nanometer level. Paired with a high-precision motor drive system, the speed of the lapping disc can be precisely adjusted, from low-speed fine lapping to high-speed rapid removal, all of which can accurately match different processing needs.
Intelligent pressure control system: capable of real-time monitoring and automatic adjustment of pressure during the lapping process. By sensing the contact pressure between the workpiece and the lapping disc through high-precision sensors, the intelligent control system can quickly respond according to preset process parameters to ensure that the pressure is always maintained at the optimal state. This not only effectively avoids surface scratches or uneven lapping caused by uneven pressure, but also greatly improves the consistency and stability of lapping.
Advanced lapping fluid supply technology: equipped with high-precision lapping fluid quantitative supply device, which can accurately control the flow rate and concentration of lapping fluid according to different lapping processes and workpiece materials. Ensure that the lapping fluid can evenly and stably cover the surface of the workpiece during the lapping process, exerting the best lapping and lubrication effects, while reducing the waste of lapping fluid and lowering production costs.
Semiconductor industry: Precision lapping machines are key equipment for achieving high-precision surface treatment in the manufacturing process of semiconductor wafers. Whether it is lapping semiconductor substrate materials such as silicon wafers and silicon carbide, or surface pretreatment before chip packaging, extremely high surface flatness and smoothness are required. This precision lapping machine can meet the strict requirements of the semiconductor industry for surface roughness at the atomic level, ensuring the performance and reliability of chips.
In the field of optics, the surface quality directly affects the optical performance of optical components such as optical lenses, prisms, and optical crystals. This precision lapping machine can achieve ultra smooth surface processing, effectively reducing surface scattering and reflection, and improving the transmittance and imaging quality of optical components. It has a wide range of applications in manufacturing high-end camera lenses, telescope lenses, and other fields.
Precision machinery manufacturing: In the fields of manufacturing precision molds, aerospace components, medical devices, etc., extremely high requirements are placed on the surface accuracy and smoothness of workpieces. Precision lapping machines can eliminate small defects and machining marks on the surface of workpieces, improve surface hardness and wear resistance, extend the service life of components, and enhance the overall performance and reliability of products.
We have formed an installation team composed of experienced technical personnel. This team can ensure the orderly installation of equipment at the customer site. During the on-site installation process, the parameters of the equipment will be tested and adjusted to ensure its normal operation.
Meanwhile, we will randomly provide a content - rich operation manual that elaborates on the various functions and operation processes of the equipment. There are not only paper materials but also installation operation videos to conduct teaching in a vivid and visual way, enabling customers to easily understand the operation of the equipment.
In addition, we offer remote support services. Through remote connection methods, our technical support team can assist customers in diagnosing faults and carrying out simple troubleshooting. Professional customer service staff provide one - on - one technical consulting services to ensure that customers can obtain accurate solutions. In case of emergency, we will give priority to providing services for customers.
As a high-tech enterprise, Hemei Semiconductor has been deeply involved in the field of precision lapping for many years, focusing on the research and development, production, and sales of lapping machines. Adhering to the concept of innovation and quality, Hemei Semiconductor provides high-quality equipment and solutions for the global manufacturing industry.
The core advantages are significant, with a research and development team gathering top talents from multiple fields, large capital investment, holding multiple patents, and promoting technological innovation. The production workshop is equipped with first-class equipment and strictly controls each link according to international standards to ensure product performance and quality.
Excellent product service, rich product line, covering large and small lapping machines, and also providing customized solutions. Pre sales technical consultation, on-time delivery during sales, 24/7 response after sales, providing comprehensive customer service.
Widely cooperating in the market, our products sell well both domestically and internationally, and have a good reputation in the semiconductor industry. We have long-term partnerships with numerous Fortune 500 companies. Collaborate with universities and research institutions to overcome challenges and participate in industry standard setting.
Looking ahead to the future, the company will continue to increase research and development investment, improve product quality, expand global markets, and aspire to become a leader in the industry, supporting the high-quality development of the manufacturing industry.
https://www.hisemitechnology.com/
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