Click image to view full size image
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Power Supply |
220V 50HZ |
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Electric Current |
6.3A |
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Plate diameter |
300mm, 350mm, 420mm |
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Plate speed |
0-120rpm (range can be adjusted) |
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Jig rotation speed |
0-120rpm (range can be adjusted) |
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Work Time |
0-10 hours |
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Acceptable Wafer Size |
3 inches, 4 inches, 6 inches |
A Wafer Lapping Polishing Machine is a specialized device used in the semiconductor industry for the precise thinning, flattening, and polishing of semiconductor wafers.
High-precision processing capability
The Wafer Lapping Polishing Machine use advanced surface grinding and polishing technology to achieve nanometer-level surface flatness and extremely low surface roughness. Its processing accuracy can usually reach ±0.001mm, meeting the stringent requirements of semiconductors, optical components and precision electronic devices for high flatness and high finish.
Intelligent control
Our equipment is equipped with a high-performance PLC intelligent control system that supports multi-parameter setting and automated operation. Users can monitor parameters such as pressure, speed, time and flow rate during the grinding and polishing process in real time through the touch screen, and quickly adjust process parameters according to process requirements.
Efficient cooling and filtration system
Our equipment uses an efficient cooling circulation system to quickly reduce the heat generated during the grinding and polishing process, prevent thermal stress and material deformation, and improve processing quality. The filtration system can automatically separate abrasives and debris to prevent wear particles from secondary contamination of the workpiece surface during the polishing process, which can improve the surface finish.
HISEMI Technology (Beijing) Ltd. is committed to promoting the development of compound semiconductor grinding and polishing equipment, focusing on developing cutting-edge processes and constantly breaking through the industry's technological boundaries.
The state-of-the-art production facility is meticulously designed to meet modern, intelligent manufacturing standards. It features a scientifically optimized layout with clearly defined production areas. The integration of advanced equipment and proprietary intelligent control systems showcases the company's technological strength. For instance, HISEMI's high-precision grinding machines achieve exceptional flatness control, maintaining grinding disc flatness errors within less than 2 nanometers. This precision lays a solid foundation for producing top-tier equipment.
HISEMI Technology (Beijing) Ltd. remains committed to becoming a global leader in semiconductor grinding and polishing equipment, driving the evolution of precision processing for semiconductor materials.
Q: How Does a Wafer Lapping Polishing Machine Work?
A: The machine uses a combination of abrasive slurry, polishing pads, and controlled pressure to gradually remove material from the wafer surface. During lapping, coarse abrasives flatten the wafer, while polishing employs finer abrasives for a smooth, reflective finish.
Q: What Are the Key Applications of a Wafer Lapping Polishing Machine?
A: These machines are essential in the semiconductor industry for processing silicon wafers used in integrated circuits, LEDs, MEMS devices, and optoelectronic components. They ensure precise surface quality for high-performance electronics.
Q: What Are the Advantages of Using a Wafer Lapping Polishing Machine?
A: The machine provides exceptional control over wafer thickness, flatness, and surface finish. It minimizes defects, reduces subsurface damage, and improves the overall performance and reliability of semiconductor devices.
Q: What Materials Can Be Processed with a Wafer Lapping Polishing Machine?
A: Commonly processed materials include silicon, gallium arsenide (GaAs), silicon carbide (SiC), sapphire, and other compound semiconductors used in microelectronics and optoelectronics.
Q: What is the Difference Between Lapping and Polishing?
A: Lapping is a material removal process that uses a slurry of coarse abrasives to achieve flatness and thickness control, while polishing uses finer abrasives to create a smooth, mirror-like finish with minimal surface defects.
Q: How is Surface Quality Measured After Lapping and Polishing?
A: Surface quality is evaluated using parameters like surface roughness (Ra), flatness, and total thickness variation (TTV). Tools such as interferometers, profilometers, and atomic force microscopes (AFM) are commonly used for precise measurements.
Q: How Can a Wafer Lapping Polishing Machine Enhance Semiconductor Manufacturing?
A: The machine enables high-precision processing, improving the performance and reliability of semiconductor devices. By delivering consistently smooth, flat surfaces, it ensures better adhesion of thin films, accurate photolithography, and reliable electronic performance.
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