Hisemi Technology（Beijing）Ltd.

 

Power Supply	220V 50HZ
Electric Current	6.3A
Plate diameter	300mm, 350mm, 420mm
Plate speed	0-120rpm (range can be adjusted)
Jig rotation speed	0-120rpm (range can be adjusted)
Work Time	0-10 hours
Acceptable Wafer Size	3 inches, 4 inches, 6 inches

 

 

Hemei Semiconductor's single-sided lapping and polishing machine is a semiconductor processing equipment that combines advanced technology and excellent performance, designed to meet the high-precision lapping and polishing needs of semiconductor manufacturing enterprises for single-sided wafers.

 

Excellent performance display

 

High precision lapping: Using the high-precision lapping system independently developed by Hemei, the flatness of the lapping disc is processed through rigorous techniques, and with precise motor speed control, nanometer level lapping accuracy can be achieved. When lapping wafers, the surface material can be uniformly and accurately removed, effectively controlling the thickness tolerance of the wafer and providing a stable and reliable foundation for subsequent processing steps.

 

Super mirror polishing: A unique polishing technique that optimizes the supply of polishing solution and the movement trajectory of the polishing head to achieve a super mirror polishing effect on one side of the wafer. Significantly reduce the roughness of the wafer surface, minimize surface defects, significantly improve the optical and electrical performance of the wafer, and meet the strict requirements of high-end chip manufacturing for wafer surface quality.

 

Innovative Technology Highlights

 

Intelligent wafer positioning system: equipped with advanced intelligent visual recognition module, it can quickly and accurately identify the edge contour, positioning marks and other features of the wafer. Automatic precise alignment of wafers before processing ensures that the lapping and polishing processes are always aligned with the target area, greatly improving the yield and production efficiency of processing.

 

Dynamic pressure regulation technology: equipped with high-precision pressure sensors, real-time monitoring of the contact pressure between the wafer and the lapping and polishing tool. According to the different materials, thicknesses, and processing stages of the wafer, the intelligent control system can dynamically adjust the pressure to ensure that the wafer surface is uniformly stressed throughout the entire processing process, avoiding wafer damage caused by improper pressure.

 

 

Integrated circuit manufacturing: In the production process of large-scale integrated circuits, extremely high requirements are placed on the flatness and surface smoothness of wafers. Hemei's single-sided lapping and polishing machine can provide high-quality wafers for key processes such as photolithography and etching in chip manufacturing, effectively improving the performance and reliability of chips.

 

Power semiconductor production: For the processing of power semiconductor wafers such as silicon carbide and gallium nitride, this equipment, with its excellent compatibility and high-precision processing capabilities, can meet the special lapping and polishing needs of different materials, helping to promote the development of the power semiconductor industry.

 

 

Professional pre-sales support: Hemei's technical expert team will have in-depth communication with customers to understand their production processes, capacity requirements, and future development plans. Based on the actual situation of the customer, provide professional equipment selection suggestions and detailed process planning to ensure that the customer selects the most suitable single-sided lapping and polishing machine for their own needs.

 

Efficient in sales service: The production department strictly follows international standards and the company's internal quality control system for equipment production, ensuring that every single-sided lapping and polishing machine has excellent quality. The logistics team adopts professional transportation solutions to ensure the safe and fast delivery of equipment to customers. At the same time, technicians will carry out equipment installation and debugging at the customer's site to ensure the smooth operation of the equipment.

 

Thoughtful after-sales care: The after-sales 24 × 7 technical support team is always on standby. When customers encounter equipment failures or technical problems, they can quickly respond and provide professional solutions. Regularly follow up with customers to understand the usage of equipment, provide equipment maintenance guidance to customers, help customers extend the service life of equipment, and improve the operational efficiency of equipment.

 

 

Hemei Semiconductor is a key force in the field of semiconductor equipment manufacturing, focusing on providing high-quality equipment and solutions for the semiconductor industry.

 

Since its establishment, Hemei has been deeply rooted in technology, production, and market with a passion for the semiconductor industry. Over the years, with keen insight and continuous innovation, we have firmly established ourselves in the fiercely competitive market and achieved rapid development.

 

Top R&D team: Bringing together professionals from various fields such as semiconductor technology and mechanical design. They devote themselves to equipment research and development with rich experience and innovative thinking. In the research and development of single-sided lapping and polishing machines, they study processes, optimize performance, and overcome technical difficulties.

 

Leading technological achievements: Through continuous research and development, we have mastered core technologies such as high-precision lapping, intelligent wafer positioning, and dynamic pressure regulation. These technologies are fully applied in single-sided lapping and polishing machines, improving equipment accuracy, efficiency, and stability, providing strong technical support for semiconductor manufacturing.

 

High performance products: With single-sided lapping and polishing machines as the core, we create multiple models of equipment with high-precision lapping and ultra mirror polishing capabilities, compatible with various wafer materials, and provide high-quality processing services for integrated circuits, power semiconductors, and other fields.

 

Comprehensive service system: Build a full process service system. Provide accurate equipment selection and process planning before sales; Strictly control production and transportation during sales, and install and debug on-site; 24/7 after-sales response, follow-up and guidance on equipment maintenance to ensure stable production.

 

Thanks to its technological, product, and service advantages, Hemei products are widely used worldwide. Cooperate with numerous well-known enterprises, establish a good brand image, and promote the development of the semiconductor industry.

https://www.hisemitechnology.com/